Interflux® IF 2005M is a low solids no-clean flux, designed to evaporate during the soldering process. This means also the safest no-clean flux for high-tech circuits. With no rosin or resin to create a sticky residue, there is nothing left after wave soldering to foul test pins or prevent electrical contact. Machine and carrier pollution is very little compared to other fluxes. This halide free flux meets all Bellcore and IPC requirements and is QPL- listed (approved to MIL-F- 14256F). It is formulated to provide the best combination of solderability, ease of processing and reliability. Great solderability on HAL, Ni Au, I-Sn, I-Ag and OSP coated PCB’s. IF2005M works great with lead-free alloys. It is resistant to elevated preheating temperatures, and to a long wave contact time with a higher working temperature.

The flux has very high compatibility with conformal coatings. The IF 2005M is classified OR/L0 per IPC J-STD-004. IF 2005M is also available in refillable flux pens for hand soldering.